Source: Adsale Industry Portal 2456.com
Bosch introduced an integrated inertial sensor modules, combining yaw rate and acceleration sensor. The device is the latest contribution by Bosch's to the automotive industry's Electronics Stability Program. That program was first introduced in 1995 and has increasingly relied on highly integrated MEMS, with up to 90% of cars having a MEMS accelerometer and 78% having a MEMS-based pressure sensor.
Jiri Marek, senior vice president of Bosch's sensors division (Germany) pointed out that these first-generation devices were hamstrung by the size of the readout circuit, which prevented the combination of angular-rate and acceleration sensors in a single small-size package. With the SM1540 combined ESP inertial sensor, Bosch has solved that integration problem.
The sensor consists of a combination of two surface micromachined MEMS sensing chips- one for angular rate, one for two-axis acceleration- stacked onto an application specific integrated circuit (ASIC) for readout. The angular-rate sensing element is an electrostatically driven and sensed vibratory gyroscope, which is manufactured in pure silicon surface micromachining, using a slightly modified Bosch foundry process with an 11-micron-thick polysilicon functional layer to form the movable parts of the micromachined structure, the company says.
(SF)
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